Toplantı 21 Temmuz 2023 tarihinde gerçekleştirilecektir.
Application Deadline: July 31, 2023, 23.59
Deadline for the international application: 8 September 2023
Applications will be received through the TÜBİTAK BİDEB Application and Monitoring System (ebideb.tubitak.gov.tr) until July 21, 2023 at 17:30.
The Scientific and Technological Research Council of Türkiye (TÜBİTAK) has announced the Falling Walls Lab TÜRKİYE programme.
Rubidium Atomic Frequency Standard Development Project Started
The new scholarship amounts are valid as of 01/07/2023.
Applications will be received through the TÜBİTAK BİDEB Application and Monitoring System (ebideb.tubitak.gov.tr) until July 21, 2023 at 17:30.
Applications will be received through the TYBS until 14 July 2023 at 17:30.
Applications should be submitted until August 1st, 2023 (10.00, CET)
The 32nd call of the IRASME network aims to support international research, development and innovation projects involving small and medium-sized enterprises (SMEs).
In the light of the discussions made by our Council and the Korea Research Foundation, it has been decided to extend the deadline for the call for bilateral cooperation to 4 July 2023.
In line with the changing rules and practices of COST, TÜBİTAK Rules fo COST Participation have been updated as of May 25, 2023.
TÜBİTAK and the Japan Society for the Promotion of Science (JSPS) will support joint research projects from scientists of both countries.
In the light of the discussions made by our Council and the French Ministry Foreign Affairs, it has been decided to extend the deadline for the call for bilateral cooperation to 5 July 2023.
Programme is carried out in cooperation with TÜBİTAK-BİDEB and UNESCO-TWAS
Scientists in Türkiye who want to propose a joint research project are required to agree with scientists working in Serbia as a project partner to carry out the project with.
TÜBİTAK and the Czech Academy of Sciences (CAS) will support joint research projects from scientists of both countries. The call is open to all scientific and technological fields.